Apparatus and method for illuminating through a circuit board

An assembly, the assembly comprising:

• a substrate with a first surface and a second surface opposite the first surface, the substrate allowing some portion of light to pass through the first surface and the second surface;
• a flexible layer with a first surface and a second surface opposite the first surface, the flexible layer allowing some portion of light to pass through the first surface and the second surface, the flexible layer having a thickness such that light passes through the flexible layer without substantial change to a color or an intensity of the light and such that the flexible layer substantially conforms to a shape of the substrate;
• and
• an adhesive coupling the second surface of the substrate and the first surface of the flexible layer, the adhesive allowing some portion of light to pass through the adhesive, the adhesive having a viscosity that substantially fills in a texture of at least one of the second surface of the substrate and the first surface of the flexible layer, the adhesive forming substantially no air gaps.

A method of manufacturing an assembly, comprising the steps of:

• providing a substrate with a first surface and a second surface opposite the first surface and that allows some portion of light to pass through the first surface and the second surface;
• providing a flexible layer with a first surface and a second surface opposite the first surface and that allows some portion of light to pass through the first surface and the second surface;
• disposing an adhesive on at least one of the second surface of the substrate and the first surface of the flexible layer;
• filling in a texture of at least one of the second surface of the substrate and the first surface of the flexible layer with the adhesive;
• and
• pressing together the substrate, the adhesive, and the flexible layer.