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US 2011/0033659 A1Published application
Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsMorio Gaku, Hidenori Kimbara, Nobuyuki Ikeguchi, Masakazu Motegi
Life of this patent
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Abstract
A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 μm, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it.
Claims3
A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin, comprising:
- at least one of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 μm, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it;
- and a copper foil placed on the surface of the prepreg, wherein a via hole, having a diameter of 0.15 mm or less, is perforated in the copper-clad laminate, and wherein the thermosetting resin composition contains 10 to 80 wt % of an insulating inorganic filler.
Dependencies are inferred from the claim text.