Microchip and Method for Manufacturing Microchip
OwnerHiroshi Hirayamainventor
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Abstract
A microchip has a resin substrate, which is provided with a first surface whereupon a channel groove is formed and a second surface on the opposite side to the first surface, and the microchip also has a resin film bonded on the first surface. A projection area is larger than the area of the first surface of the resin substrate when the resin substrate is viewed from a direction orthogonally intersecting with the first surface. Thus, warpage of the microchip can be suppressed at the time of thermally bonding the resin substrate and the resin film by a roller.
Claims9
A microchip comprising:
- a resin substrate provided with a first surface on which flow path grooves are formed and
- a second surface which is located on an opposite side of the first surface;
- and
- a resin film bonded to the first surface;
- wherein a projected area of the resin substrate, when viewed from a direction perpendicular to the first surface, is larger than the area of the first surface of the resin substrate.
A method for manufacturing a microchip having a resin substrate provided with a first surface on which flow path grooves are formed and a second surface which is located on an opposite side of the first surface and having a shape in which a projected area when viewed from a direction perpendicular to the first surface is larger than an area of the first surface, and a resin film bonded to the first surface,
- wherein the method comprising the steps of:
- fixing a sidewall of the resin substrate using a jig;
- and
- bonding a resin film on a surface of the resin substrate which is fixed with the above jig.
Dependencies are inferred from the claim text.