Annealing apparatus
AssigneeTokyo Electron Limited
InventorsShigeru Kasai, Hiroyuki Miyashita, Tomohiro Suzuki, Masatake Yoneda, Kazuhiro Ooya
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Electron Limited
InventorsShigeru Kasai, Hiroyuki Miyashita, Tomohiro Suzuki, Masatake Yoneda, Kazuhiro Ooya
Estimating the term…
An annealing apparatus includes heating sources 17a and 17b provided to face a wafer W, the heating sources 17a and 17b having LEDs 33 emitting lights to the wafer; light-transmitting members 18a and 18b for transmitting the lights emitted from the LEDs 33; and cooling members 4a and 4b made of aluminum and provided to directly contact with the heating sources 17a and 17b, respectively. The heating sources 17a and 17b include a plurality of LED arrays having supporters 32 made of AlN, each having one surface on which the LEDs 33 are adhered by using a silver paste 56; and other surface on which thermal diffusion members 50 made of copper are adhered by using a solder 57. The LED arrays 34 are fixed to the cooling member 4a(4b) by using screws via a silicon grease.
An annealing apparatus comprising:
An annealing apparatus comprising:
An annealing apparatus comprising:
Dependencies are inferred from the claim text.