Multi-band, multi-drop chip to chip signaling

A method of signaling between a memory controller and respective first and second memory devices coupled to a multi-drop bus via respective stubs, the multi-drop bus comprising first and second transmission line segments, the method comprising:

• establishing a first communication path between the memory controller and the first memory device, the first communication path spectrally exhibiting a first group of passbands separated by a first set of one or more attenuation notches;
• establishing a second communication path between the memory controller and the second memory device, the second communication path spectrally exhibiting a second group of passbands separated by a second set of one or more attenuation notches;
• and
• spectrally aligning the first set of one or more attenuation notches with the second set of one or more attenuation notches by configuring at least one of the respective stubs and first and second transmission line segments to electrically cooperate together in a deterministic manner.

A chip to chip signaling system including:

• a transmission line;
• a master integrated circuit (IC) device coupled to the transmission line;
• a plurality of slave IC devices coupled to the transmission line to define a multi-drop bus, wherein each of the plurality of slave IC devices communicates with the master IC device via respective communication paths, each communication path exhibiting multiple tones corresponding to separate signal subchannels;
• and
• wherein the master IC device includes core logic to dynamically allocate the separate signal subchannels between the master IC device and slave IC devices.

A transmission line comprising:

• a first communication path spectrally exhibiting a first group of passbands separated by a first set of one or more attenuation notches, the first communication path comprising a first segment having ends;
• first and second stubs, wherein the first segment is coupled at each end to the first and second stubs, respectively;
• a second communication path spectrally exhibiting a second group of passbands separated by a second set of one or more attenuation notches, the second communication path comprising a second segment having ends;
• a third stub, wherein the second segment is coupled at each end to the first stub and the third stub, respectively;
• wherein the first, second and third stubs electrically cooperate with each other and the first and second segments such that the first set of one or more attenuation notches is spectrally aligned with the second set of one or more attenuation notches.