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US 2011/0032685 A1Published application
Interposer, module, and electronics device including the same
AssigneeSony Corporation
InventorsAkira Akiba, Shun Mitarai, Koichi Ikeda, Shinya Morita
Life of this patent
Estimating the term…
Abstract
An interposer with which the manufacturing steps are able to be simplified and which shows superior high frequency characteristics is provided. The interposer includes: a substrate having a front face and a rear face; a wiring that is formed on the front face side of the substrate and is electrically connected to a semiconductor chip; an electric device connected to the wiring; and a concave section that is formed from the rear face side of the substrate in a position corresponding to the electric device.
Claims12
An interposer comprising:
- a substrate having a front face and a rear face;
- a wiring that is formed on the front face side of the substrate and is electrically connected to a semiconductor chip;
- an electric device connected to the wiring;
- and
- a concave section that is formed from the rear face side of the substrate in a position corresponding to the electric device.
2 more elements
A module comprising:
- an interposer;
- and
- a semiconductor chip mounted on the interposer, wherein the interposer includes
- a substrate having a front face and a rear face, in which the semiconductor chip is mounted on the front face side,
- a wiring that is formed on the front face side of the substrate and is electrically connected to the semiconductor chip,
- an electric device connected to the wiring, and
- a concave section that is formed from the rear face side of the substrate in a position corresponding to the electric device.
4 more elements
An electronics device comprising:
- an interposer;
- a semiconductor chip mounted on the interposer;
- and
- a mount substrate electrically connected to the interposer, wherein the interposer includes
- a substrate having a front face and a rear face, in which the semiconductor chip is mounted on the front face side,
- a wiring that is formed on the front face side of the substrate and is electrically connected to the semiconductor chip,
- an electric device connected to the wiring, and
- a concave section that is formed from the rear face side of the substrate in a position corresponding to the electric device.
5 more elements
Dependencies are inferred from the claim text.