Terminal structure and manufacturing method thereof, and electronic device and manufacturing method thereof

A terminal structure comprising:

• a first conductor;
• a resin film which does not include a reinforcing material and covers the first conductor;
• an opening formed in a region of the resin film, wherein the opening overlaps with the first conductor;
• and
• a second conductor in contact with the first conductor in the opening.

An electronic device comprising:

• an insulating film;
• at least one electronic element covered with the insulating film;
• a conductor formed over the insulating film and electrically connected to the electronic element;
• a resin film including a reinforcing material and covering the insulating film and the conductor;
• and
• an opening formed in a region of the resin film, which overlaps with the conductor and is provided with the reinforcing material.

An electronic device comprising:

• an insulating film;
• at least one electronic element covered with the insulating film;
• a conductor formed over the insulating film and electrically connected to the electronic element;
• a resin film which does not include a reinforcing material and covers the insulating film and the conductor;
• and
• an opening formed in a region of the resin film, which overlaps with the conductor and is provided with the reinforcing material.

An electronic device comprising:

• a circuit including at least one electronic element formed over a first insulating film;
• a second insulating film covering the at least one electronic element;
• a first conductor formed over the second insulating film and electrically connected to the at least one electronic element;
• a first resin film including a first reinforcing material and covering the second insulating film and the first conductor;
• an opening formed in a region of the first resin film, which overlaps with the first conductor and is provided with the first reinforcing material;
• a second conductor in contact with the first conductor at the opening;
• and
• a second resin film including a second reinforcing material and covering the first insulating film of the electronic element.

An electronic device comprising:

• a circuit including at least one electronic element formed over a first insulating film;
• a second insulating film covering the at least one electronic element;
• a first conductor formed over the second insulating film and electrically connected to the at least one electronic element;
• a first resin film which does not include a reinforcing material and covers the second insulating film and the first conductor;
• an opening formed in a region of the first resin film, which overlaps with the first conductor;
• a second conductor in contact with the first conductor at the opening;
• and
• a second resin film including a reinforcing material and covering the first insulating film of the electronic element.

An electronic device comprising:

• a circuit including at least one electronic element formed over a first insulating film;
• a second insulating film covering the at least one electronic element;
• a first conductor formed over the second insulating film and electrically connected to the at least one electronic element;
• a first resin film including a reinforcing material and covering the second insulating film and the first conductor;
• an opening formed in a region of the first resin film, which overlaps with the first conductor and is provided with the reinforcing material;
• a second conductor in contact with the first conductor at the opening;
• and
• a second resin film which does not include a reinforcing material and covers the first insulating film of the electronic element.

A method for manufacturing a terminal structure, comprising:

• forming a first conductor having a projecting portion over an insulating surface;
• attaching a prepreg including a reinforcing material to the insulating surface and a surface of the first conductor so that a region of the prepreg, which is attached to the first conductor, is thinner than another region of the prepreg;
• curing the prepreg attached to the insulating surface and the surface of the first conductor to form an insulating film including the reinforcing material;
• reducing a thickness of the insulating film without removal of the reinforcing material so that an opening is formed in a region of the insulating film, which overlaps with the first conductor;
• and
• forming a second conductor in contact with the first conductor at the opening.

A method for manufacturing an electronic device including a first insulating film and at least one electronic element covered with the first insulating film, comprising:

• forming over the first insulating film a conductor having a projecting portion and electrically connected to at least one of the electronic element;
• attaching a prepreg including a reinforcing material to an upper surface of the first insulating film and a surface of the conductor so that a region of the prepreg, which is attached to the conductor, is thinner than another region of the prepreg;
• curing the prepreg attached to the upper surface of the first insulating film and the surface of the conductor to form a second insulating film including the reinforcing material;
• and
• reducing a thickness of the second insulating film without removal of the reinforcing material so that an opening is formed in a region of the second insulating film, which overlaps with the conductor.

A method for manufacturing an electronic device, comprising:

• forming a circuit including a plurality of electronic elements over a substrate with a separation film and a first insulating film interposed therebetween;
• forming a second insulating film covering the circuit;
• forming over the second insulating film a first conductor having a projecting portion and electrically connected to at least one of the electronic elements;
• attaching a first prepreg including a first reinforcing material to an upper surface of the second insulating film and a surface of the first conductor so that a region of the first prepreg, which is attached to the first conductor, is thinner than another region of the first prepreg;
• curing the first prepreg attached to the upper surface of the second insulating film and the surface of the first conductor to form a third insulating film including the first reinforcing material;
• reducing a thickness of the third insulating film without removal of the first reinforcing material so that an opening is formed in a region of the third insulating film, which overlaps with the first conductor;
• forming a second conductor in contact with the first conductor at the opening;
• causing separation inside the separation film and/or at an interface between the separation film and the first insulating film to separate the substrate from the circuit, after formation of the second conductor;
• attaching a second prepreg including a second reinforcing material so that it covers the first insulating film, after separation of the substrate;
• and
• curing the second prepreg to form a fourth insulating film including the second reinforcing material.

A method for manufacturing an electronic device, comprising:

• forming a circuit including a plurality of electronic elements over a substrate with a separation film and a first insulating film interposed therebetween;
• forming a second insulating film covering the circuit;
• forming over the second insulating film a first conductor having a projecting portion and electrically connected to at least one of the electronic elements;
• attaching a first prepreg including a first reinforcing material to an upper surface of the second insulating film and a surface of the first conductor so that a region of the first prepreg, which is attached to the first conductor, is thinner than another region of the first prepreg;
• curing the first prepreg attached to the upper surface of the second insulating film and the surface of the first conductor to form a third insulating film including the first reinforcing material;
• causing separation inside the separation film and/or at an interface between the separation film and the first insulating film to separate the substrate from the circuit;
• attaching a second prepreg including a second reinforcing material so that it covers the first insulating film, after separation of the substrate;
• and
• curing the second prepreg to form a fourth insulating film including the second reinforcing material;
• forming an opening in a region of the third insulating film, which overlaps with the first conductor, by reducing a thickness of the third insulating film without removal of the first reinforcing material, after formation of the fourth insulating film;
• and
• forming a second conductor in contact with the first conductor at the opening.