Nano-tube thermal interface structure

A structure, comprising:

• a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure;
• an electrically and thermally heat sink;
• a electrically and thermally carrier layer;
• a plurality of electrically and thermally nano-tubes a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer;
• a plurality of electrically and thermally heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.

A method for forming a structure, comprising:

• providing a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure;
• providing an electrically and thermally conductive heat sink;
• providing a unit comprising:
• a electrically and thermally conductive carrier layer;
• a plurality of electrically and thermally conductive nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer;
• a plurality of heat conductive tips disposed on distal ends of the plurality of nano-tubes;
• providing a sandwich structure comprising the provided unit disposed between the provided heat sink and provided semiconductor structure with the plurality of heat conductive tips on the first portion of the plurality of nano-tubes positioned in contact with the conductive layer and with the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being positioned in contact with the heat sink.
• applying heat to the sandwich structure to simultaneously bond:
• (1) the plurality of heat conductive tips on the first portion of the plurality of nano-tubes to the conductive layer;
• and (2) the plurality of heat conductive tips on the second portion of the plurality of nano-tubes to the heat sink.