Memory Heat Sink System

An information handling system, comprising:

• a board;
• a processor coupled to the board;
• a memory module coupled to the board and the processor;
• and
• a memory heat sink system coupled to the memory module, wherein the memory heat sink system comprises:
• a base comprising a plurality of first sides and a second side, wherein the plurality of first sides are oriented substantially perpendicularly to the second side, and wherein the base is coupled to the memory module;
• a plurality of convective heat transfer members extending from each of the plurality of first sides;
• and
• at least one conductive liquid cooling coupling surface located on the second side.

A method for cooling a memory module, comprising:

• providing a memory module;
• coupling a memory heat sink system to the memory module, wherein the memory heat sink system comprises a base including a first side having a convective heat transfer member and a second side having a least one conductive liquid cooling coupling surface, wherein the first side is oriented substantially perpendicularly to the second side;
• coupling the memory module to an information handling system;
• and
• cooling the memory module using one of either the convective heat transfer member and the conductive liquid cooling coupling surface.