Optical module for a camera device, baffle substrate, wafer scale package, and manufacturing methods therefor
AssigneeHeptagon Oy
InventorsMarkus Rossi, Hartmut Rudmann, Ville Kettunen
Life of this patent
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AssigneeHeptagon Oy
InventorsMarkus Rossi, Hartmut Rudmann, Ville Kettunen
Estimating the term…
An optical module for a camera device, the camera device including an image capturing element arranged on a base substrate portion, and has a top lens element and optionally further lens elements for imaging an object on the image capturing element, and further a baffle defining a predetermined field of view of the image capturing element. The baffle includes a generally transparent baffle substrate portion having a front surface and a rear surface, a generally non-transparent first layer with a plurality of first openings on the front surface and a generally non-transparent second layer with a plurality of second openings on the rear surface. The top lens element is arranged on the front and/or the rear surface of the baffle substrate, which leads to a reduced number layers/substrates in the module and to a reduced number of reflections on material-air interfaces, for example. The baffle has an improved ability to suppress unwanted light and enables protection of the inner part of the device as well as manufacture on wafer scale.
An optical module for a camera device, said camera device including an image capturing element arranged on a base substrate portion, the optical module comprising:
Baffle substrate with a plurality of baffles, comprising:
Method for manufacturing a plurality of optical modules, comprising the following steps:
Method for manufacturing a baffle substrate with a plurality of baffles, comprising the steps of:
Method according to claim 32, further comprising the step of forming the first and second openings by selectively removing material of the layers.
Dependencies are inferred from the claim text.