Image sensor module and method for manufacturing the same
AssigneeHynix Semiconductor Inc.
InventorSeung Taek YANG
Life of this patent
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Abstract
An image sensor module includes a semiconductor chip, a transparent substrate, and metal lines. The semiconductor chip includes image sensors disposed in an image sensor region, pads electrically connected to the image sensors and disposed in a peripheral region defined along a periphery of the image sensor region, and through-electrodes electrically connected to the pads. The transparent substrate has a groove defined by a surface covering the image sensors and the pads of the semiconductor chip. The metal lines are disposed on a lower surface of the semiconductor chip and are electrically connected to the through-electrodes.
Claims20
An image sensor module having an image sensor region and a peripheral region defined along a periphery of the image sensor region, the image sensor module comprising:
- a semiconductor chip comprising:
- image sensors disposed in the image sensor region;
- pads disposed in the peripheral region and electrically connected to the image sensors;
- and
- through-electrodes electrically connected to the pads;
- a transparent substrate having a groove defined by a surface covering the image sensors and the pads of the semiconductor chip;
- and
- metal lines disposed on a lower surface of the semiconductor chip and electrically connected to the through-electrodes.
A method for manufacturing an image sensor module, comprising the steps of:
- providing a semiconductor chip comprising:
- image sensors formed in an image sensor region, pads electrically connected to the image sensors and disposed in a peripheral region defined along a periphery of the image sensor region, and through-electrodes electrically connected to the pads;
- providing a transparent substrate having a groove defined so as to form an inner surface;
- coupling the transparent substrate and the semiconductor chip such that the inner surface of the transparent substrate and the image sensors face each other;
- and
- forming metal lines on a lower surface of the semiconductor chip electrically connected to the through-electrodes.
Dependencies are inferred from the claim text.