Flip chip package for monolithic switching regulator

A method of connecting to a monolithic voltage regulator, the method comprising:

• a) using a plurality of bumps on said monolithic voltage regulator to form connections to source and drain terminals of a transistor of said monolithic voltage regulator;
• b) using a first surface of a single layer lead frame to connect to said monolithic voltage regulator via said plurality of bumps, said first surface having a first pattern, said single layer lead frame comprising said first surface and a second surface, said single layer lead frame having a plurality of interleaving lead fingers for connecting to said plurality of bumps;
• c) using a flip-chip package to encapsulate said monolithic voltage regulator, said plurality of bumps, and said single layer lead frame;
• and
• d) using said second surface of said single layer lead frame to provide external connectors to said monolithic voltage regulator at said flip-chip package, wherein said second surface comprises a second pattern that is different from said first pattern.

A voltage regulator device, comprising:

• a) means for connecting to a monolithic voltage regulator using a first surface of a single layer lead frame and a plurality of bumps on said monolithic voltage regulator, said first surface having a first pattern, said single layer lead frame comprising said first surface and a second surface, said single layer lead flame having a plurality of interleaving lead fingers for connecting to said plurality of bumps;
• b) means for encapsulating said monolithic voltage regulator, said plurality of bumps, and said single layer lead frame, in a flip-chip package;
• and
• c) means for providing external connections to said monolithic voltage regulator at said flip-chip package using said second surface of said single layer lead frame, wherein said second surface comprises a second pattern that is different from said first pattern.