Led lighting system
OwnerArnold Stoll, Paul von Zittwitzinventors
Life of this patent
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Abstract
An illumination apparatus includes a LED assembly having a plurality of LED modules and a substrate. Each LED module includes an anode and a cathode. The substrate is generally planar and defined by a first side and a second side with the LED modules extending from the first side. The second side is defined by a heat dissipation surface, and wherein the first side is opposite the second side. The apparatus also includes a heat sink having a plurality of fins for heat dissipation. A heat input surface portion of the heat sink is bonded to the heat dissipation surface of the LED assembly. The apparatus further includes a control system for supplying electrical energy to the LED assembly, wherein the electrical energy is pulse width modulated.
Claims16
An illumination apparatus, comprising:
- a LED assembly having a plurality of LED modules and a substrate, wherein each LED module includes an anode and a cathode, wherein the substrate is generally planar and defined by a first side and a second side with the LED modules extending from the first side, wherein the second side is defined by a heat dissipation surface, and wherein the first side is opposite the second side;
- a heat sink having a plurality of fins for heat dissipation, wherein a heat input surface portion of the heat sink is bonded to the heat dissipation surface of the LED assembly;
- and
- a control system for supplying electrical energy to the LED assembly, wherein the electrical energy is pulse width modulated.
A method, comprising:
- removing a protective portion from a heat dissipation surface of a substrate, wherein the substrate is generally planar and defined by a first side and a second side with a plurality of LED modules extending from the first side, wherein the second side is defined by the heat dissipation surface, and wherein the first side is opposite the second side;
- applying a first thermally conductive adhesive to at least a portion of the heat dissipation surface;
- applying a second thermally conductive adhesive to at least a portion of a heat sink having a plurality of fins for heat dissipation, wherein a heat input surface portion of the heat sink is bonded to the heat dissipation surface of the LED assembly;
- coupling a power source for supplying electrical energy to the LED assembly, wherein the electrical energy is pulse width modulated;
- and
- coupling a control system to the power source for controlling the power source.
Dependencies are inferred from the claim text.