Light emitting device packages with improved heat transfer

A light emitting device package, the package comprising:

• a body having at least one thermal element and at least one electrical element, the at least one electrical and thermal elements having bottom surfaces wherein the electrical element comprises a bend and a first portion which is substantially orthogonal to a second portion;
• at least one light emitting device mounted on a top surface of the thermal element and electrically connected to the electrical element;
• and
• the bottom surface of the electrical element extending away from the body a first distance, and the bottom surface of the thermal element extending away from the body a second distance that is greater than the first distance.

A molded leadframe light emitting device package, the package comprising:

• a molded body having at least one thermal element and at least one electrical lead extending directly from a bottom surface of the molded body;
• at least one light emitting device mounted on a top surface of the thermal element and electrically connected to the electrical element;
• and
• the electrical lead extending away from the body a first distance and the thermal element extending away from the body a second distance that is greater than the first distance.

A light emitting device package, the package comprising:

• a body having at least one thermal element and at least one electrical element disposed on a bottom surface of the body, the at least one thermal and electrical elements having bottom surfaces;
• at least one light emitting device mounted on a top surface of the body;
• and
• the bottom surface of the electrical element extending away from the body a first distance and the bottom surface of the thermal element extending away from the body a second distance that is greater than the first distance.

A light emitting device package mounted to an external substrate comprising:

• a body having at least one electrical element and at least one thermal element;
• at least one light emitting device mounted on a top surface of the thermal element and electrically connected to the electrical element;
• and
• the external substrate comprising a notch configured to receive at least a portion of the at least one thermal element.

A light emitting device package, the package comprising:

• a body having at least one electrical element and at least one thermal element, the at least one electrical and thermal elements having bottom surfaces;
• at least one light emitting device mounted on a top surface of the thermal element and electrically connected to the electrical element;
• and
• the thermal element having a first exposed portion disposed above a bottom surface of the electrical element and a second exposed portion disposed below the bottom surface of the electrical element, and the bottom surface of the electrical element extending away from the body a first distance and the bottom surface of the thermal element extending away from the body a second distance that is greater than the first distance.