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US 2011/0031703 A1Published application
Seal structure
AssigneeNok Corporation
InventorTakahiro Hayashi
Life of this patent
Estimating the term…
Abstract
In order to provide excellent waterproofness at a low manufacturing cost to a seal structure comprising a housing to which a flexible wiring board (1) is inserted and a seal member (3) integrally formed on said flexible wiring board (1) for hermetically sealing a gap between said housing and said flexible wiring board (1), a whole surface of a sensor member (31) arranged on at least one side of said flexible wiring board (1) is coated by same material as is used in said seal member (3), at a time of integrally forming the seal member (3) on the flexible wiring board (1).
Claims8
A sealing structure comprising:
- a housing to which a flexible wiring board is inserted;
- and
- a seal member integrally formed on said flexible wiring board for hermetically sealing a gap between said housing and said flexible wiring board,
- wherein a whole surface of a sensor member arranged on at least one side of said flexible wiring board is coated by a material which is used in said seal member.
1 more element
Dependencies are inferred from the claim text.