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US 2011/0031635 A1Published application
Stacked Integrated Circuit Device
AssigneeMao Bang Electronic Co., Ltd.
InventorsTse Ming Chu, Sung Chuan MA
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Abstract
A device having stacked integrated circuit (IC) chips is provided. The chips and other wires are connected through circuit contacts and notches or apertures. The notches or apertures are filled with a conductive material. Thus, flexibility of circuit layout is achieved with easy fabrication and enhanced reliability.
Claims12
A stacked integrated circuit device, comprising:
- at least one chip, said chip having a plurality of circuit contacts and a plurality of circuit areas;
- at least one notch, said notch being located on a peripheral surface of said chip;
- at least one aperture, said aperture being located at center of said chip,
- wherein said aperture is obtained through hot drilling and an insulative layer is obtained on obtaining said aperture through hot drilling;
- a conductive material, said conductive material being located in said notch and said aperture;
- and
- a plurality of wires, said wire connecting said circuit contact, said circuit area and said conductive material.
4 more elements
Dependencies are inferred from the claim text.