Semiconductor device module and method of manufacturing semiconductor device module

An electronic circuit unit comprising a semiconductor device module that includes

• a first substrate layer on which a first semiconductor device is surface-mounted;
• a second substrate layer that is a layer laminated on a side of the first substrate layer on which the first semiconductor device is not surface-mounted, a second semiconductor device being surface-mounted on a surface of the second substrate layer and not on a side of the first substrate layer;
• and
• a hollow section that is a space sandwiched between the first substrate layer and the second substrate layer and formed on back sides of areas on which the first semiconductor device and the second semiconductor device are surface-mounted.

An electronic device comprising a semiconductor device module that includes

• a first substrate layer on which a first semiconductor device is surface-mounted;
• a second substrate layer that is a layer laminated on a side of the first substrate layer on which the first semiconductor device is not surface-mounted, a second semiconductor device being surface-mounted on a surface of the second substrate layer and not on a side of the first substrate layer;
• and
• a hollow section that is a space sandwiched between the first substrate layer and the second substrate layer and formed on back sides of areas on which the first semiconductor device and the second semiconductor device are surface-mounted.

A method of manufacturing a semiconductor device module comprising:

• printing, on predetermined positions on a flexible substrate for each semiconductor device, a first mount section and a second mount section on which a first semiconductor device and a second semiconductor device are to be surface-mounted, respectively, a connection pad for connecting the semiconductor device to the circuit substrate, and a wiring pattern for connecting each of the first mount section and the second mount section to the connection pad;
• temporarily mounting the semiconductor device on the flexible substrate by fixing, to a supporting plate, the flexible substrate on which the wiring pattern is printed at the printing and by applying solder paste to the mount pad;
• attaching opposed areas of the flexible substrate at a position that is not a position where the semiconductor devices are opposed to each other after folding the flexible substrate at a fold line set between the semiconductor devices;
• fixing the semiconductor device that is mounted on the mount pad at the mounting by reflow soldering;
• and
• fixing attached areas of the flexible substrate that are attached at the attaching to the semiconductor device by folding the attached areas such that a connection surface of the connection land for connecting to the circuit substrate faces the circuit substrate, wherein
• the printing includes printing the connection land at a different distance from the mount pad for each of the semiconductor devices.

A method of manufacturing a mount component for mounting a semiconductor device on a circuit substrate, the semiconductor device being surface-mounted on two sides via a mount pad arranged in a grid pattern, the manufacturing method comprising:

• printing, at predetermined positions on a rigid substrate for each semiconductor device, a mount pad for mounting the semiconductor device and a socket connection pattern for connecting the semiconductor device to a socket arranged on the circuit substrate;
• temporarily mounting the semiconductor device on the rigid substrate by fixing, to a supporting plate, the rigid substrate on which the socket connection pattern is printed at the printing and by applying solder paste to the mount pad;
• attaching opposed areas of the rigid substrate at a position that is not a position where the semiconductor devices are opposed to each other;
• and
• fixing the semiconductor device that is mounted on the mount pad at the mounting by reflow soldering.

A flexible substrate comprising:

• a first mount section on which a first semiconductor device is surface-mounted and a second mount section on which a second semiconductor device is surface-mounted;
• a first connection land that has a connection surface for connecting the first semiconductor device to a circuit substrate and a second connection land that has a connection surface for connecting the second semiconductor device to the circuit substrate;
• and
• a first wiring pattern for connecting the first mount section to the first connection land and a second wiring pattern for connecting the second mount section to the second connection land, wherein
• the first mount section, the second mount section, the first connection land, the second connection land, the first wiring pattern, and the second wiring pattern are arranged on the same surface of the flexible substrate, and
• the first connection land and the second connection land are located at different distances from the first mount section and the second mount section, respectively.