MEMS and a Protection Structure Thereof

A protection structure of a pad, wherein the pad is disposed in a dielectric layer on a semiconductor substrate and the pad comprises a connection region and a peripheral region which encompasses the connection region, the protection structure comprising:

• at least a barrier disposed in the dielectric layer of the peripheral region, wherein the barrier encompasses the connection region;
• an insulation layer disposed on the dielectric layer, wherein the barrier vertically connects the insulation layer and the pad;
• and
• a mask layer disposed on the dielectric layer, wherein the mask layer covers the insulation layer and comprises an opening to expose the connection region of the pad.