Semiconductor package having a heat dissipation member
AssigneeHynix Semiconductor Inc.
InventorSeung Taek YANG
Life of this patent
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Abstract
A semiconductor package having a heat dissipation member capable of efficiently conveying excess heat away from semiconductor chips is presented. The semiconductor package includes a semiconductor chip, through-electrodes, and a heat dissipation member. The semiconductor chip has a first surface, a second surface facing away from the first surface, and bonding pads which are disposed on the first surface. The through-electrodes are electrically connected with the bonding pads and passing through the first and second surfaces of the semiconductor chip, and protrude outward from the second surface. The heat dissipation member faces the second surface of the semiconductor chip and is coupled to the through-electrodes.
Claims18
A semiconductor package comprising:
- a semiconductor chip having a first surface, a second surface facing away from the first surface, and bonding pads disposed on the first surface;
- through-electrodes passing through the semiconductor chip, the through-electrodes electrically connected with the bonding pads and protrudes outward away from the second surface of the semiconductor chip;
- and
- a heat dissipation member facing the second surface of the semiconductor chip and defined with through-holes coupled with the portion of the through-electrodes that protrudes outward away from the second surface of the semiconductor chip.
Dependencies are inferred from the claim text.