Power semiconductor circuit device and method for manufacturing the same

A power semiconductor circuit device equipped with a power semiconductor element, said device comprising:

• a base board on which at least said power semiconductor element is mounted;
• a resin which molds said base board and said power semiconductor element in a state where partial surfaces of said base board, including a base board surface opposite to a surface on which said power semiconductor element is mounted, are exposed;
• and
• a heat dissipating fin formed on the exposed surfaces of said base board by raising up the surfaces.

A method for manufacturing a power semiconductor circuit device equipped with a power semiconductor element, said method comprising:

• mounting at least said power semiconductor element on one surface of a base board and forming a groove which is for joining in an opposite surface of said base board;
• molding said base board and said power semiconductor element in a state where partial surfaces of said base board, including the base board surface opposite to the surface on which said power semiconductor element is mounted, are exposed;
• and then,
• fixing said heat dissipating fin by caulking to the groove of said base board.

A power semiconductor circuit device comprising:

• a power semiconductor element which generates heat;
• a metal substrate in which said power semiconductor element is mounted on one surface, a plurality of parallel grooves are formed in other surface, and an insulating layer is formed between the one surface and the other surface;
• a molding resin which coats said power semiconductor element and covers the one surface and an outer peripheral portion on the one surface side of said metal substrate;
• and
• a heat dissipating fin which has a caulking portion folded and formed in a V shape, and is plastically deformed so that the caulking portion is crushed to be fixed by caulking in the groove and so that a protruded portion from the groove of the caulking portion is located at a position lower than a bottom surface of the groove.

A method for manufacturing a power semiconductor circuit device, comprising:

• a step of mounting a power semiconductor element on a metal frame;
• a step of locating said metal frame on one surface of a metal base in which a plurality of parallel grooves are formed in the other surface;
• a step of coating said power semiconductor element and said metal frame and covering the one surface and an outer peripheral portion on the one surface side of said metal base, with a molding resin;
• and
• a step of plastically deforming so that a caulking portion folded and formed in a substantially V shape of a sheet metal heat dissipating fin is crushed to be fixed by caulking in the groove and so that a protruded portion from the groove of the caulking portion is located at a position lower than a bottom surface of the groove.