Semiconductor device, semiconductor device manufacturing method, printed circuit board and electronic device

A semiconductor device comprising:

• a plate-shaped supporter which includes at least one groove;
• a flexible circuit board which covers a face of the plate-shaped supporter where the at least one groove is provided and at least a portion of a back of the face, and to which at least one electronic part may be mounted;
• at least one first electronic part mounted to the flexible circuit board in a region that is opposed to the at least one groove of the plate-shaped supporter;
• at least one second electronic part mounted to a face of the flexible circuit board that is opposite to a face opposed to the at least one groove of the plate-shaped supporter;
• and
• a solder bump mounted to a portion of the flexible circuit board that covers a face of the plate-shaped supporter that is opposite the face where the at least one groove is formed.

A method of manufacturing a semiconductor device, comprising:

• a step (a) of mounting a first electronic part to one face of a flexible circuit board;
• a step (b) of mounting a supporter, which includes a groove that houses the first electronic part, to the one face of the flexible circuit board so as to enclose the first electronic part;
• a step (c) of bending the flexible circuit board along a perimeter of the supporter to be wrapped around at least one side face of the supporter and at least a portion of a face of the supporter that is opposite to a face where the groove is formed, and adhering the flexible circuit board to at least the portion of the face of the supporter;
• a step (d) of mounting a second electronic part to a face of the flexible circuit board that is opposite to the one face where the first electronic part is mounted;
• and
• a step (e) of forming a solder bump on a portion of the flexible circuit board that is adhered to the face of the supporter that is opposite to the face where the groove is formed.