Power device package and method of fabricating the same
OwnerTae Hyun KIM, Seog Moon Choi +3inventors
InventorsTae Hyun KIM, Seog Moon Choi, Tae Hoon Kim, Bum Sik Jang, Ji Hyun Park
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Abstract
Disclosed is a power device package, which has high heat dissipation performance and includes an anodized metal substrate including a metal plate having a cavity formed on one surface thereof and an anodized layer formed on both the surface of the metal plate and the inner wall of the cavity and a circuit layer formed on the metal plate, a power device mounted in the cavity of the metal plate so as to be connected to the circuit layer, and a resin sealing material charged in the cavity of the metal plate. A method of fabricating the power device package is also provided.
Claims14
A power device package, comprising:
- an anodized metal substrate including a metal plate having a cavity formed on one surface thereof and an anodized layer formed on both a surface of the metal plate and an inner wall of the cavity, and a circuit layer formed on the anodized layer;
- a power device mounted in the cavity of the metal plate so as to be connected to the circuit layer;
- and
- a resin sealing material charged in the cavity of the metal plate.
A method of fabricating a power device package, comprising:
- forming an anodized layer on both a surface of a metal plate having a cavity formed on one surface thereof and an inner wall of the cavity, and then forming a circuit layer on the anodized layer;
- mounting a power device in the cavity so as to be connected to the circuit layer;
- and
- filling the cavity with a resin sealing material.
Dependencies are inferred from the claim text.