Package structure and package process
AssigneeHTC Corporation
InventorChien-Liang Lee
Life of this patent
Estimating the term…
Abstract
A package structure and a package process are provided. In the package process, firstly, a first electronic component having a plurality of first conductive bumps at a bottom thereof is provided. Then, a first insulation paste is coated on the first conductive bumps. The first electronic component is disposed on a circuit substrate having a plurality of substrate pads, and the first conductive bumps are respectively situated on the substrate pads. Next, a heating process is performed to both of the first conductive bumps and the first insulation paste, wherein the first conductive bumps is reflowed to bond the first electronic component and the substrate pads, and the first insulation paste is cured.
Claims10
A package process, comprising:
- providing a first electronic component, and the first electronic component having a plurality of first conductive bumps on a bottom thereof;
- coating a first insulation paste on the first conductive bumps;
- disposing the first electronic component on a circuit substrate having a plurality of substrate pads, and the first conductive bumps being respectively situated on the substrate pads;
- and
- performing a heating process to both of the first conductive bumps and the first insulation paste, so that the first conductive bumps are reflowed to bond the first electronic component and the corresponding substrate pads, and the first insulation paste is cured.
A package structure, comprising:
- a circuit substrate, having a plurality of substrate pads;
- a first electronic component, disposed on the circuit substrate;
- a plurality of first conductive bumps, each of the first conductive bumps being connected to the first electronic component and the corresponding substrate pad;
- and
- a first insulation paste, disposed between the first electronic component and the circuit substrate, the first electronic component having a first vertical projection region on the circuit substrate, and the first insulation paste being located in the first vertical projection region.
Dependencies are inferred from the claim text.