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US 2011/0031598 A1Published application
Semiconductor device and fabricating method thereof
AssigneeAmkor Technology Korea, Inc.
InventorsChoon Heung LEE, Ki Cheol BAE, Do Hyun NA
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Abstract
A semiconductor device and a method of fabricating the same are disclosed. An interposer used for the semiconductor device includes integrated circuits therein to realize the functions of a decoupling capacitor, an ESD preventing circuit, an impedance matching circuit, and termination. Therefore, it is possible to improve the reliability of the operation of the semiconductor device.
Claims18
A semiconductor device, comprising:
- a substrate including lands provided on the lower surface thereof and conductive patterns electrically connected to the lands thereon;
- a semiconductor die formed on the substrate and electrically connected to the conductive patterns;
- an interposer formed on the substrate or the semiconductor die and including at least one integrated circuit connected to the semiconductor die therein;
- and
- an encapsulant formed on the substrate to surround the semiconductor die and the interposer.
2 more elements
A method of fabricating a semiconductor device, the method comprising:
- forming a semiconductor die on a substrate;
- forming an interposer including at least one integrated circuit connected to the semiconductor die therein on the substrate or on the semiconductor die;
- and
- performing encapsulation to surround the semiconductor die and the interposer.
1 more element
Dependencies are inferred from the claim text.