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US 2011/0031597 A1Published application
Semiconductor device and method including first and second carriers
AssigneeInfineon Technologies AG
InventorsStefan Landau, Joachim Mahler, Thomas Wowra
Life of this patent
Estimating the term…
Abstract
A semiconductor device and method. One embodiment provides an integral array of first carriers and an integral array of second carries connected to the integral array of first carriers. First semiconductor chips are arranged on the integral array of first carriers. The integral array of second carriers is arranged over the first semiconductor chips.
Claims23
A device, comprising:
- a first carrier;
- a first semiconductor chip arranged on the first carrier;
- and
- a second carrier arranged over the first semiconductor chip, wherein the first carrier and the second carrier are formed integrally.
1 more element
A device, comprising:
- a first carrier;
- a first semiconductor chip arranged on the first carrier, wherein the first semiconductor chip has a first electrode on a first main surface and a second electrode on a second main surface;
- and
- a second carrier arranged over the first semiconductor chip, wherein the first carrier and the second carrier are formed integrally and are parts of a leadframe.
1 more element
A device, comprising:
- a first carrier;
- a first semiconductor chip arranged on the first carrier;
- and
- a second carrier arranged over the first semiconductor chip, wherein the first carrier and the second carrier are formed integrally,
- wherein the first semiconductor chip is covered with a mold material, and at least one surface of the first carrier and at least one surface of the second carrier are uncovered by the mold material, and
- wherein a connection element connects the first carrier to the second carrier, and at least one surface of the connection element is uncovered by the mold material.
3 more elements
A device, comprising:
- means for providing a first carrier;
- a first semiconductor chip arranged on the first carrier;
- and
- means for providing a second carrier arranged over the first semiconductor chip, wherein the first carrier means and the second carrier means are formed integrally.
1 more element
Dependencies are inferred from the claim text.