Microwave module
AssigneeRohde & Schwarz GmbH & Co. KG
InventorsWerner Perndl, Thomas Reichel
Life of this patent
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Abstract
In a microwave module with at least one semiconductor chip, which provides on its upper side a connecting-line structure formed in particular as a coplanar line, which is connected to at least one adjacent incoming and/or outgoing line structure formed on the upper side of the substrate, the chip is glued with its underside and all lateral surfaces, on which no high-frequency connecting lines lead to the chip, within a recess of a metal part with good thermal conduction.
Claims6
A microwave module with at least one semiconductor chip , which provides on its upper side a connecting-line structure designed in particular as a coplanar line, and is inserted in a recess of a metal part of suitable thermal conduction and of which the connecting-line structure is connected to at least one adjacent incoming and/or outgoing line structure formed on the upper side of a substrate, characterized in that
- the semiconductor chip is glued with its underside and its lateral surfaces in the recess of a metal part by means of an adhesive with a high thermal conductivity,
- that an adhesive is used, which hardens a low temperature in such a manner that thermal stresses during manufacture are avoided,
- that the semiconductor chip is glued into the recess in such a manner that a gap between the base and the lateral walls of the recess and the underside and respectively the lateral surfaces of the semiconductor chip is completely filled, and
- that the substrate providing on its upper side the incoming and/or outgoing line structure is glued into a recess of the metal part separated from the recess of the semiconductor chip in such a manner that its upper surface is disposed in the same plane as the upper surface of the semiconductor chip.
3-6. (canceled)
(canceled)
Dependencies are inferred from the claim text.