Semiconductor package and stacked semiconductor package having the same

A stacked semiconductor package comprising:

• a plurality of semiconductor packages each including:
• a semiconductor chip having a shape with corners and formed a circuit section therein, the semiconductor chip having one or more chamfered portions which are formed in a first corner group that includes one or more of the corners,
• at least one data bonding pad disposed on the semiconductor chip and electrically connected to the circuit section, and
• a chip selection pad disposed adjacent to a second corner group that includes at least one of the corners which is not formed with a chamfered portion, the chip selection pad being electrically connected to the circuit section,
• wherein the semiconductor packages are vertically stacked such that the chip selection pad of any one of the semiconductor packages is exposed by a chamfered portion of another of the semiconductor packages, and the at least one data bonding pad of the respective semiconductor packages are electrically connected to one another.