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US 2011/0031590 A1Published application
Liquid film assisted laser die marking and structures formed thereby
AssigneeIntel Corporation
InventorsGeorge P. Vakanas, Sergei L. Voronov, Luey Chon Ng, George E. Malouf
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Abstract
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a liquid on a region of a die, and then forming an identification mark through the liquid on the die.
Claims20
A method comprising:
- forming a liquid on a region of a die;
- and
- forming an identification mark through the liquid on the die.
A method comprising:
- dispensing a liquid droplet on a middle portion of a backside of a packaged silicon die;
- forming an identification mark on the packaged silicon die through the liquid using a laser marking tool;
- and
- removing the liquid droplet from the backside of the packaged silicon die surface.
1 more element
A structure comprising:
- an identification mark on a die, wherein the identification mark does not comprise a splatter pattern surrounding the identification mark.
Dependencies are inferred from the claim text.