Waterproof smd led module and method of manufacturing the same
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsMIN-TSUN HSIEH, LUNG-HSIN CHEN, SHEN-BO LIN, CHING-LIEN YEH, CHIH-YUNG LIN
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Abstract
A surface-mount device (SMD) light emitting diode (LED) module includes a leadframe, an LED chip, a waterproof protective film and a sealing material. The leadframe includes a plurality of leads and the LED chip is fixed on one of the leads. The waterproof protective film covers the LED chip and a portion of the leadframe, and exposes a portion of the leadframe for connecting to a circuit board. The sealing material is also formed on the leadframe to cover the LED chip. In addition, a method of manufacturing the SMD LED module is provided.
Claims20
A waterproof surface-mount device (SMD) light emitting diode (LED) module, comprising:
- a leadframe, comprising a plurality of leads;
- at least one LED chip fixed on one of the leads;
- a waterproof protective film covering the LED chip and a portion of the leadframe and exposing portions of the leads for electrically connecting to an external device;
- and
- a sealing material formed on the leadframe to cover the LED chip.
A waterproof LED module, comprising:
- a substrate;
- a plurality of LED components disposing on the substrate;
- and
- a waterproof protective film overlaying on the substrate and the plurality of LED components.
A method of manufacturing a waterproof surface-mount device (SMD) light emitting diode (LED) module, comprising:
- providing a leadframe, the leadframe comprising a plurality of leads;
- covering a portion of the leadframe with a tape
- fixing an LED chip on at least one of the leads;
- electrically connecting the leads with the LED chip;
- and
- providing a waterproof protective film enveloping the LED chip.
Dependencies are inferred from the claim text.