Encapsulated lens stack
AssigneeHeptagon Oy
InventorsMarkus Rossi, Hartmut Rudmann, Ville Kettunen
Life of this patent
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Abstract
A wafer scale package includes two or more substrates (wafers) that are stacked in an axial direction and a plurality of replicated optical elements. An optical device includes one or more optical elements. The wafer scale package and the device include one or more cavities that house the optical elements, while the end faces of the package or the device are planar and do not have replicated optical elements thereon. The number of double sided substrates is reduced, and design and manufacture of the optical device is improved.
Claims24
Wafer scale package, comprising:
- at least two outer substrates stacked in an axial direction,
- a plurality of cavities in between the substrates, and a plurality of replicated optical elements arranged the cavities,
- wherein at least two optical elements are arranged in one common cavity at a distance from one another as seen in the axial direction, and
- wherein the package comprises two essentially planar end faces that are constituted by outer surfaces of the outer substrates.
Optical device comprising.;
- at least two outer substrate portions stacked in an axial direction,
- at least one cavity in between the substrate portions, and
- at least two replicated optical elements arranged in the at least one cavity at a distance from one another as seen in the axial direction,
- wherein the optical device comprises two essentially planar end faces that are constituted by outer surfaces of the outer substrate portions.
Method for producing a wafer scale package comprising the steps of:
- providing two substrates, each having an inner surface and an outer surface;
- providing the inner surfaces of the substrates with a plurality of optical elements by means of a replication technique, while leaving the outer surfaces empty;
- stacking the at least two substrates in an axial direction such that the inner surfaces and the optical elements thereon face one another;
- connecting the outer substrates to form a package in such a way that cavities are formed in between the outer substrates, each cavity enclosing at least two optical elements at a distance from one another as seen in the axial direction, wherein end faces of the package are essentially planar and are constituted by the outer surfaces of the outer substrates.
Dependencies are inferred from the claim text.