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US 2011/0031504 A1Published application
Apparatus and method for increasing thermal conductivity of a substrate
OwnerNathaniel R. Quick, Aravinda Karinventors
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OwnerNathaniel R. Quick, Aravinda Karinventors
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An apparatus and method is disclosed for increasing the thermal conductivity in a substrate of a non-wide bandgap material comprising the steps of directing a thermal energy beam onto the substrate in the presence of a first doping gas for converting a region of the substrate into a wide bandgap material to enhance the thermal conductivity of the substrate for cooling the non-wide bandgap material. In one example, the invention is incorporated into a carbon rich layer formed within the wide bandgap material. In another example, the invention is incorporated into a carbon rich layer formed within the wide bandgap material having basal planes disposed to extend generally outwardly relative to an external surface of the substrate to enhance the cooling of the substrate.
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A silicon substrate having enhanced thermal dissipating properties, comprising:
A non-wide bandgap substrate having enhanced thermal dissipating properties, comprising:
A silicon carbide substrate having enhanced thermal dissipating properties, comprising:
A wide bandgap substrate having enhanced thermal dissipating properties, comprising:
Dependencies are inferred from the claim text.