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US 2011/0031448 A1Published application
Copper Powder for Conductive Paste and Conductive Paste
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsKoyu Ota, Touru Kurimoto, Yoshiaki Uwazumi, Koichi Miyake, Katsuhiko Yoshimaru
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Abstract
Copper powder is provided, which, while having fine granularity, does not loose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.07 to 10 atomic % Al inside each copper particle in the powder.
Claims15
A copper powder for conductive paste comprising a plurality of copper articles wherein each copper article contains 0.07 to 10 atomic % Al.
Dependencies are inferred from the claim text.