Cleaning-free activated resinous composition and method for surface mounting using the same
AssigneeSan-Ei Kagaku Co., Ltd.
InventorsKazunori Kitamura, Yasuhiro Takase
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Abstract
Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.
Claims5
An activated resinous composition containing, on the basis of an epoxy resin being solid at a room temperature of 100 parts by weight, a carboxylic acid compound of 1 to 10 parts by weight, a hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and a solvent of 10 to 300 parts by weight.
Dependencies are inferred from the claim text.