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US 2011/0031150 A1Published application
Perforated Blister Packaging
AssigneeHewlett-Packard Development Company, L.P.
InventorLarry Trigg
Life of this patent
Estimating the term…
Abstract
A blister package includes a plastic blister being between top and bottom covers. The plastic blister further includes a perforation that partially extends around a product enclosure. A cut line intersects the perforation along an interior portion of the plastic blister to provide a location for tearing the product enclosure from the plastic blister.
Claims20
1) A blister package, comprising:
- a top cover;
- a bottom cover;
- and
- a plastic blister being between the top and bottom covers and including a perforation that partially extends around a product enclosure, wherein a cut line intersects the perforation along an interior portion of the plastic blister to provide a location for tearing the product enclosure from the plastic blister.
1 more element
8) A method, comprising:
- providing a blister package with a perforation that partially extends around a perimeter of a product without extending to an edge of the blister package;
- hiding the perforation with a cover attached to the blister package;
- and
- providing instructions to cut the blister package to expose the perforation at an edge formed by cutting of the blister package so a user is able to tear open the blister package and access the product.
1 more element
14) A blister package, comprising:
- a plastic blister including a product enclosure for enclosing a product, a flat package support adjacent the product enclosure, and a perforation that extends on the flat package support without extending to an edge of the plastic blister;
- a top cover attached to a first side of the plastic blister and visibly covering the perforation;
- and
- a bottom cover attached to a second side of the plastic blister.
1 more element
Dependencies are inferred from the claim text.