Design and use of dc magnetron sputtering systems
AssigneeHoneywell International Inc.
InventorsEal H. Lee, Jaeyeon Kill
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Abstract
Field-enhanced sputtering targets are disclosed that include: a core material; and a surface material, wherein at least one of the core material or the surface material has a field strength design profile and wherein the sputtering target comprises a substantially uniform erosion profile. Target assembly systems are also disclosed that include a field-enhanced sputtering target; and an anodic shield. Additionally, methods of producing a substantially uniform erosion on a sputtering target are described that include: providing an anodic shield; providing a cathodic field-enhanced target; and initiating a plasma ignition arc, whereby the arc is located at the point of least resistance between the anodic shield and the cathodic field-enhanced target.
Claims20
A field-enhanced sputtering target, comprising:
- a core material;
- and
- a surface material, wherein at least one of the core material or the surface material has a field strength design profile and wherein the sputtering target comprises a substantially uniform erosion profile.
A target assembly system, comprising:
- a field-enhanced sputtering target;
- and
- an anodic shield.
A method of producing a substantially uniform erosion on a sputtering target, comprising:
- providing an anodic shield;
- providing a cathodic field-enhanced target;
- and
- initiating a plasma ignition arc, whereby the arc is located at the point of least resistance between the anodic shield and the cathodic field-enhanced target.
Dependencies are inferred from the claim text.