Method for fabricating lead frame of light emitting diode
AssigneeEverlight Electronics Co., Ltd.
InventorShang-Ho Hung
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Abstract
A method for fabricating lead frames of light emitting diodes (LEDs) including following steps is provided. First, a conductive frame tape is provided. The conductive frame tape includes a plurality of conductive frames arranged along an extending direction of the conductive frame tape. Each of the conductive frames has a first connection portion adapted to carry an LED chip. Next, a plurality of first sputter layers are selectively sputtered onto the conductive frame tape through at least one target, and the first sputter layers are formed on the first connection portions, respectively.
Claims10
A method for fabricating a lead frame of a light emitting diode (LED), comprising:
- providing a conductive frame tape comprising a plurality of conductive frames arranged along an extending direction of the conductive frame tape, wherein each of the conductive frames has a first connection portion adapted to carry an LED chip;
- and
- selectively sputtering a plurality of first sputter layers onto the conductive frame tape through at least one target, and respectively forming the first sputter layers on the first connection portions, wherein a mask is disposed between the target and the conductive frame tape, and the mask has a plurality of openings for exposing the first connection portions.
Dependencies are inferred from the claim text.