Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

A circuit subassembly, comprising:

• a conductive layer;
• and
• a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition:
• a polybutadiene or polyisoprene resin,
• about 30 to about 70 percent by weight, of a magnesium hydroxide having less than about 1000 ppm of an ionic contaminant, and
• about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen;
• and
• wherein the circuit subassembly has a UL-94 rating of at least V-1.

A circuit subassembly, comprising:

• a conductive layer;
• a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition
• a polybutadiene or polyisoprene resin, and
• about 50 to about 80 percent by weight, of a magnesium hydroxide having less than about 1000 ppm of an ionic contaminant;
• and
• an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive layer comprises a poly(arylene ether);
• wherein the circuit material has a UL-94 rating of at least V-1.

A circuit subassembly, comprising:

• a conductive layer;
• and
• a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition:
• a polybutadiene or polyisoprene resin, and
• about 50 to about 80 percent by weight, of a magnesium hydroxide having less than about 1000 ppm of an ionic contaminant;
• wherein the circuit material has a UL-94 rating of at least V-1.

A circuit subassembly, comprising

• a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition:
• a polybutadiene or polyisoprene resin;
• about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants;
• and
• about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the compound comprises at least about 15 weight percent of nitrogen;
• wherein the circuit subassembly has a UL-94 rating of at least V-1.

A circuit subassembly, comprising

• a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition
• a polybutadiene or polyisoprene resin, and
• about 50 to about 80 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants;
• wherein the circuit subassembly has a UL-94 rating of at least V-1.