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US 2011/0031002 A1Published application
Printed wiring board having metal layers producing eutectic reaction
AssigneeFujitsu Limited
InventorsTaiji Sakai, Seiki Sakuyama
Life of this patent
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Abstract
A printed wiring board includes a Cu wiring pattern formed on a substrate. A first metal layer is formed on the Cu wiring pattern. A second metal layer is formed on the first metal layer. The first metal layer has a less reactivity with Cu than the second metal layer. The first metal layer and the second metal layer together cause an eutectic reaction.
Claims10
A printed wiring board comprising:
- a substrate;
- a Cu wiring pattern formed over said substrate;
- a first metal layer formed on said Cu wiring pattern;
- a second metal layer formed on said first metal layer,
- wherein said first metal layer has a less reactivity with Cu than said second metal layer, and said first metal layer and said second metal layer together cause an eutectic reaction.
2 more elements
A manufacturing method of a printed wiring board, comprising:
- forming a first metal layer on a Cu wiring pattern formed on a substrate;
- forming a second metal layer on said first metal layer, the second metal layer producing an eutectic reaction with said first metal layer;
- and
- reflowing said first and second metal layers to produce the eutectic reaction between said first and second metal layers,
- wherein said first metal layer has a less reactivity with Cu than said second metal layer.
2 more elements
Dependencies are inferred from the claim text.