Composite metal fine particle material, metal film and manufacturing method of the metal film, and printed wiring board and cable
AssigneeHitachi Cable, Ltd.
InventorsDai ISHIKAWA, Tomiya ABE, Masanobu ITO
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Abstract
A composite metal fine particle material is provided, in which spherical silver nanoparticles synthesized from a silver compound, a solvent, a reducing agent, and a dispersant, and conductive fillers compose of non-spherical metal fine particles, are mixed. For example, the conductive fillers composed of the non-spherical metal fine particles are formed into slender columnar shapes, plate shapes, or ellipsoidal shapes.
Claims17
A composite metal fine particle material, wherein spherical silver nanoparticles synthesized from a silver compound, a solvent, a reducing agent, and a dispersant, and conductive fillers composed of non-spherical metal fine particles, are mixed.
A composite metal fine particle material, wherein spherical silver nanoparticles coated with a dispersant, and conductive fillers composed of metal fine particles having columnar shapes, plate shapes, or slender shapes of ellipsoidal shapes, are mixed.
A manufacturing method of a metal film, comprising the steps of:
- coating a surface of a base material with a composite metal fine particle material, in which spherical silver nanoparticles are synthesized by using a silver compound, a solvent, a reducing agent, a dispersant, and conductive fillers composed of non-spherical metal fine particles, being dispersed in a solvent;
- setting in a sintering furnace, the base material the surface of which is coated with the composite metal fine particle material;
- and
- forming a metal film by sintering the composite metal fine particle material on the surface of the base material, with temperature/time conditions in the sintering furnace set to be 300° C. or less and 10 minutes or less.
Dependencies are inferred from the claim text.