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US 2011/0031000 A1Published application
Resin composition, carrier material with resin, multi-layered printed circuit board, and semiconductor device
AssigneeSumitomo Bakelite Co., Ltd.
InventorsToshio Komiyatani, Masayoshi Kondo
Life of this patent
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Abstract
There is disclosed a resin composition used for forming a resin layer in a sheet-formed carrier material with a resin, comprising a polyfunctional epoxy resin (a) having three or more glycidyl ether groups with an epoxy equivalent of 100 to 300, a compound (b) having one or more carboxyl groups with a melting point of equal to or more than 50 degrees C. and equal to or less than 230 degrees C., and a curing agent (c).
Claims21
A resin composition used for a resin layer in a sheet-formed carrier material with a resin for bonding between substrates in which a metal conductive material is formed, comprising:
- a polyfunctional epoxy resin (a) having three or more glycidyl ether groups with an epoxy equivalent of 100 to 300,
- a compound (b) having one or more carboxyl groups with a melting point of equal to or more than 50 degrees C. and equal to or less than 230 degrees C. or less, and
- a curing agent (c).
Dependencies are inferred from the claim text.