Metal circuit wiring having organic resin for adhesive layers and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoung-Il LEE, Sung-Eun Kim, Tae-Hoon Kim, Young-Kwan Seo
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Abstract
The invention is to provide a metal circuit wiring having an organic adhesive layer, the metal circuit wirings comprising: an organic adhesive layer formed with a resin selected from the group consisting of acrylic resin, chloroprene rubber and silicone rubber resin; and metal wiring patterns formed with an ink composition including metal nanoparticles, in which the metal wiring exhibits excellent adhesive between metal nano materials and the substrate and electrical property.
Claims11
A metal circuit wiring having an organic adhesive layer, the metal circuit wirings comprising:
- an organic adhesive layer formed with a resin selected from the group consisting of acrylic resin, chloroprene rubber and silicone rubber resin;
- and metal nanoparticles;
- and
- metal wiring patterns formed with an ink composition including metal nanoparticles.
A method for manufacturing a metal circuit wiring having an organic adhesive layer, the method comprising:
- forming an organic adhesive layer of a resin selected from the group consisting of acryl, chloroprene rubber and silicone rubber resin on a substrate;
- forming metal wiring patterns with an ink composition comprising metal nanoparticles on the organic adhesive layer-formed substrate;
- and
- curing the metal wiring patterns.
Dependencies are inferred from the claim text.