Printed Circuit Board Removing Bonding Sheet Around Signal Transmission Line
AssigneeGigalane Co., Ltd.
InventorsYong Goo Lee, Kyoung II Kang
Life of this patent
Estimating the term…
Abstract
There is provided a printed circuit board (PCB) comprising a first ground layer extended in one direction; a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; a first bonding sheet disposed above the first dielectric layer; a second bonding sheet disposed above the first dielectric layer, a second dielectric layer disposed above the signal transmission line, the first bonding sheet, and the second bonding sheet; and a second ground layer laminated on the second dielectric layer.
Claims21
A printed circuit board (PCB) comprising:
- a first ground layer extended in one direction;
- a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer;
- a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer;
- a first bonding sheet disposed above the first dielectric layer, separated from the signal transmission line at a predetermined interval on one side thereof, and extended in the same direction of the signal transmission line;
- a second bonding sheet disposed above the first dielectric layer, separated from the signal transmission line at a predetermined interval on another side thereof, and extended in the same direction of the signal transmission line;
- a second dielectric layer disposed above the signal transmission line, the first bonding sheet, and the second bonding sheet;
- and
- a second ground layer laminated on the second dielectric layer,
- wherein the first and second bonding sheets bond the first dielectric layer to the second dielectric layer.
A PCB comprising:
- a first ground layer extended in one direction;
- a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer;
- a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer;
- a bonding sheet disposed above the signal transmission line and extended in the same direction of the signal transmission line;
- a second dielectric layer disposed above the signal transmission line and the bonding sheet;
- and
- a second ground layer laminated on the second dielectric layer,
- wherein the bonding sheet comprises a plurality of patterns formed by boring the bonding sheet with a predetermined interval in one or more lines in a longitudinal direction of the bonding sheet.
A PCB comprising:
- a first ground layer extended in one direction;
- a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer;
- a first bonding sheet and a second bonding sheet disposed on both edges of the first dielectric layer in a longitudinal direction thereof, respectively;
- a second dielectric layer disposed above the first bonding sheet and the second bonding sheet;
- a signal transmission line formed on one of a bottom and a top of the second dielectric layer and extended in the same direction of the second dielectric layer;
- a third bonding sheet and a fourth bonding sheet disposed on both edges of the second dielectric layer in a longitudinal direction thereof, respectively;
- a third dielectric layer disposed above the third bonding sheet and the fourth bonding sheet;
- and
- a second ground layer laminated on the third dielectric layer and extended in the same direction of the third dielectric layer.
Dependencies are inferred from the claim text.