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US 2011/0030923 A1Published application
Thermal module
AssigneeFoxconn Technology Co., Ltd.
InventorsCHENG-JEN LIANG, JUI-WEN HUNG, NIEN-TIEN CHENG
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Abstract
A thermal module comprises a cooling fan, a heat pipe and a fin assembly. The cooling fan defines an air outlet therein. The fin assembly is mounted at the air outlet of the cooling fan. The heat pipe comprises an evaporating section attached to the cooling fan and a condensing section attached to the fin assembly. The evaporating section of the heat pipe is wholly located within an inner space of the cooling fan.
Claims18
A thermal module, comprising:
- a cooling fan defining an air outlet therein;
- a fin assembly mounted at the air outlet of the cooling fan;
- and
- a heat pipe comprising an evaporating section attached to the cooling fan and a condensing section attached to the fin assembly, the evaporating section being wholly located within an internal space of the cooling fan.
1 more element
A thermal module comprising:
- a fan comprising:
- a housing having a top plate, a bottom plate below the top plate and an air outlet at a side of the housing between the top and bottom plates;
- and
- an impeller rotatably mounted on the top plate and positioned between the top and bottom plates;
- a heat pipe having an evaporating portion totally received in the housing of the fan and mounted in the bottom plate of the housing and a condensing portion extending to the outlet of the housing;
- and
- a fin assembly attached to the condensing portion of the heat pipe.
4 more elements
Dependencies are inferred from the claim text.