Thermal module mount structure

Abstract

A thermal module mount structure including a first mount body and a second mount body. The first mount body defines therein a first passage and has multiple engaging sections inward extending into the first passage. The second mount body is disposed in the first passage and has multiple complementary engaging sections complementary to the engaging sections. Each of the complementary engaging sections has a moving space and multiple engaging splits in communication therewith. The second mount body is vertically displaceable within the first passage, whereby the first and second mount bodies can be relatively rotated to insert the engaging sections into the engaging splits at different heights. Accordingly, the height of the mount structure is changeable by means of adjusting the second mount body in accordance with different heights of radiating fins. Therefore, the mount structure has high commonness so that the cost for developing the molds is reduced.

Dependencies are inferred from the claim text.