Substrate treatment apparatus and substrate treatment method

A substrate treatment apparatus for supplying a coating solution to a substrate with projections and depressions on a front surface thereof to form a coating film on the front surface of the substrate, comprising:

• a coating unit for forming the coating film on the front surface of the substrate;
• an etching unit for etching the coating film formed on the substrate;
• a heating unit having a heating means for heating the substrate;
• a temperature adjusting means for adjusting the temperature of said heating means;
• a cooling unit having a cooling means for cooling the substrate;
• a carrier unit for carrying-in/out the substrate between said coating unit, etching unit, heating unit, and cooling unit;
• and
• a control means for controlling said units and said temperature adjusting means,
• wherein said coating unit comprises a holding means for holding the substrate to be horizontally rotatable, and a coating solution supply nozzle for supplying the coating solution to the substrate held by said holding means,
• wherein said etching unit comprises a holding means for holding the substrate to be horizontally rotatable, and an etching solution supply nozzle for supplying an etching solution for etching the coating film formed on the substrate, and
• wherein said control means executes a step of supplying the coating solution to the substrate rotated by said holding means of said coating unit to form a coating film on the front surface of the substrate, a step of heating the substrate having the coating film formed thereon to adjust an etching condition of the coating film, a step of supplying the etching solution to the substrate to etch the coating film, a step of supplying the coating solution to the substrate to form a flat coating film on the front surface of the substrate, and then a step of heating the substrate to cure the coating film.