Adhesive sheet for supporting and protecting semiconductor wafer and method for grinding back of semiconductor wafer

Abstract

An adhesive sheet for supporting and protecting a semiconductor wafer has an intermediate layer and an adhesive layer formed on a one side of a base film in this order, the adhesive layer being made of a radiation curing type adhesive, and having a thickness of 1 to 50 μm and a shear stress of 0.5 to 10 MPa, the intermediate layer having a thickness of 10 to 500 μm and an elastic modulus of 0.01 to 3 MPa. The adhesive sheet of the present invention is useful in the broader application such as an adhesive sheet for affixing a wafer and for protecting a wafer, and the like in various steps of working the semiconductor wafers, that needs re-peelable.

Dependencies are inferred from the claim text.