Thermoelectric modules and related methods
AssigneeLaird Technologies, Inc.
InventorsRobert Michael Smythe, Jeffrey Gerard Hershberger, Richard F. Hill
Life of this patent
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AssigneeLaird Technologies, Inc.
InventorsRobert Michael Smythe, Jeffrey Gerard Hershberger, Richard F. Hill
Estimating the term…
An example thermoelectric module of the present disclosure generally includes a first laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, a second laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, and thermoelectric elements disposed generally between the first and second laminates. At least one of the dielectric layers is a polymeric dielectric layer. The electrically conductive layer of the first laminate is at least partially removed to form electrically conductive pads on the first laminate. The electrically conductive layer of the second laminate is at least partially removed to form electrically conductive pads on the second laminate. The thermoelectric elements are coupled to the electrically conductive pads of the first and second laminates for electrically coupling the thermoelectric elements together.
A thermoelectric module comprising:
A method of making a thermoelectric module, the method comprising coupling multiple thermoelectric elements to first and second laminates such that the multiple thermoelectric elements are disposed generally between the first and second laminates, wherein the first and second laminates each include an electrically conductive layer coupled to a dielectric layer, and wherein the dielectric layer of the first laminate and/or the dielectric layer of the second laminate is a polymeric dielectric layer, and wherein the multiple thermoelectric elements are coupled to the electrically conductive layers of the first and second laminates.
A thermoelectric module comprising:
Dependencies are inferred from the claim text.