Back to results
US 2011/0030473 A1Published application
Micromachined inertial sensor devices
AssigneeFairchild Semiconductor Corporation
InventorCenk Acar
Life of this patent
Estimating the term…
Abstract
A micromachined inertial sensor with a single proof-mass for measuring 6-degree-of-motions. The single proof-mass includes a frame, an x-axis proof mass section attached to the frame by a first flexure, and a y-axis proof mass section attached to the frame by a second flexure. The single proof-mass is formed in a micromachined structural layer and is adapted to measure angular rates about three axes with a single drive motion and linear accelerations about the three axes.
Claims25
A sensor for measuring a motion thereof, comprising:
- a frame;
- a first planar proof mass section attached to the frame by a first flexure;
- and
- a second planar proof mass section attached to the frame by a second flexure;
- wherein the frame, the first planar proof mass section, and the second planar proof mass section are formed in a micromachined layer and are adapted to measure angular rates about three axes and linear accelerations about the three axes.
2 more elements
A device for measuring a motion thereof, comprising:
- a first wafer;
- a device layer including:
- a frame;
- a first planar proof mass section attached to the frame by a first flexure;
- and
- a second planar proof mass section attached to the frame by a second flexure;
- wherein the frame, the first planar proof mass section, and the second planar proof mass section are formed in a micromachined layer and are adapted to measure angular rates about three axes and linear accelerations about the three axes;
- and
- a second wafer, the first and second wafer being bonded to the device layer.
6 more elements
Dependencies are inferred from the claim text.