Method for manufacturing terminal structure and method for manufacturing electronic device

A method for manufacturing an electronic device, comprising the steps of:

• preparing one or more electronic elements covered with a first insulating film;
• forming over the first insulating film a protrusion formed using a conductor which is electrically connected to at least one of the electronic elements;
• attaching a prepreg including a reinforcing material to a top surface of the first insulating film and a surface of the protrusion to form a portion of a top surface of the prepreg, which protrudes due to the protrusion;
• curing the prepreg attached to the top surface of the first insulating film and the surface of the protrusion to form a second insulating film including the reinforcing material;
• and
• removing a protruding portion of a top surface of the second insulating film together with the reinforcing material to form an opening in the second insulating film.

A method for manufacturing an electronic device, comprising the steps of:

• forming a separation film over a substrate;
• forming a first insulating film over the separation film;
• forming a circuit including a plurality of electronic elements, over the first insulating film;
• forming a second insulating film covering the circuit;
• forming over the second insulating film a protrusion formed using a conductor, which is electrically connected to at least one of the electronic elements;
• attaching a first prepreg including a first reinforcing material to a top surface of the second insulating film and a surface of the protrusion to form a portion of a top surface of the first prepreg, which protrudes due to the protrusion;
• curing the first prepreg attached to the top surface of the second insulating film and the surface of the protrusion to form a third insulating film including the first reinforcing material;
• removing a protruding portion of a top surface of the third insulating film together with the first reinforcing material to form an opening in the third insulating film;
• separating the circuit from the substrate;
• attaching a second prepreg including a second reinforcing material to the first insulating film so as to cover the first insulating film after the substrate is separated;
• and
• curing the second prepreg to form a fourth insulating film including the second reinforcing material.

A method for manufacturing an electronic device, comprising the steps of:

• forming a separation film over a substrate;
• forming a first insulating film over the separation film;
• forming a circuit including a plurality of electronic elements, over the first insulating film;
• forming a second insulating film covering the circuit;
• forming over the second insulating film a protrusion formed using a conductor, which is electrically connected to at least one of the electronic elements;
• attaching a first prepreg including a first reinforcing material to a top surface of the second insulating film and a surface of the protrusion to form a portion of a top surface of the first prepreg, which protrudes due to the protrusion;
• curing the first prepreg attached to the top surface of the second insulating film and the surface of the protrusion to form a third insulating film including the first reinforcing material;
• separating the circuit from the substrate;
• attaching a second prepreg including a second reinforcing material to the first insulating film so as to cover the first insulating film after the substrate is separated;
• curing the second prepreg to form a fourth insulating film including the second reinforcing material;
• and
• removing a protruding portion of a top surface of the third insulating film together with the first reinforcing material to form an opening in the third insulating film after the fourth insulating film is formed.

A method for manufacturing a terminal structure, comprising the steps of:

• forming over an insulating surface a protrusion formed from a conductor;
• attaching a resin film to the insulating surface and a surface of the protrusion to form a portion of a top surface of the resin film, which protrudes due to the protrusion;
• curing the resin film attached to the insulating surface and the surface of the protrusion to form an insulating film;
• and
• removing a protruding portion of a top surface of the insulating film to form an opening in the insulating film.

A method for manufacturing an electronic device, comprising the steps of:

• preparing one or more electronic elements covered with a first insulating film;
• forming over the first insulating film a protrusion formed from a conductor ,which is electrically connected to at least one of the electronic elements;
• attaching a resin film to a top surface of the first insulating film and a surface of the protrusion to form a portion of a top surface of the resin film, which protrudes due to the protrusion;
• curing the resin film attached to the top surface of the first insulating film and the surface of the protrusion to form a second insulating film;
• and
• removing a protruding portion of a top surface of the second insulating film to form an opening in the second insulating film.

A method for manufacturing an electronic device, comprising the steps of:

• forming a separation film over a substrate;
• forming a first insulating film over the separation film;
• forming a circuit including a plurality of electronic elements, over the first insulating film;
• forming a second insulating film covering the circuit;
• forming over the second insulating film a protrusion formed from a conductor, which is electrically connected to at least one of the electronic elements;
• attaching a first resin film to a top surface of the second insulating film and a surface of the protrusion to form a portion of a top surface of the first resin film, which protrudes due to the protrusion;
• curing the first resin film attached to the top surface of the second insulating film and the surface of the protrusion to form a third insulating film;
• removing a protruding portion of a top surface of the third insulating film to form an opening in the third insulating film;
• separating the circuit from the substrate;
• attaching a second resin film to the first insulating film so as to cover the first insulating film after the substrate is separated;
• and
• curing the second resin film to form a fourth insulating film.

A method for manufacturing an electronic device, comprising the steps of:

• forming a separation film over a substrate;
• forming a first insulating film over the separation film;
• forming a circuit including a plurality of electronic elements over the first insulating film;
• forming a second insulating film covering the circuit;
• forming over the second insulating film a protrusion formed from a conductor, which is electrically connected to at least one of the electronic elements;
• attaching a first resin film to a top surface of the second insulating film and a surface of the protrusion to form a portion of a top surface of the first resin film, which protrudes due to the protrusion;
• curing the first resin film attached to the top surface of the second insulating film and the surface of the protrusion to form a third insulating film;
• separating the circuit from the substrate;
• attaching a second resin film to the first insulating film so as to cover the first insulating film after the substrate is separated;
• curing the second resin film to form a fourth insulating film;
• and
• removing a protruding portion of a top surface of the third insulating film to form an opening in the third insulating film after the fourth insulating film is formed.