US 2011/0030209 A1 · METHOD FOR FABRICATING THIN TOUCH SENSOR PANELS

Abstract

A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment.

Claims11

Dependent claims

A method for fabricating thin touch sensor panels, comprising:

providing a first substrate having a first thickness, a first surface, and a second surface;
providing a second substrate having a second thickness, a third surface, and a fourth surface;
forming thin film patterns on the first surface;
forming thin film patterns on the third surface;
joining the first substrate and the second substrate together to form a first sandwich with the first surface and the third surface facing each other;
thinning both outer surfaces of the first sandwich;
and
separating the first substrate and the second substrate of the first sandwich from each other.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application

12/908,763Filed 20 Oct 2010

Priority

9 Jan 2009

Published

10 Feb 2011

Term ends

Not estimatedThe source records don’t support an estimate.

Classification16 codes

H05K 3/0097
Apparatus or processes for manufacturing printed circuits: processing two or more printed circuits simultaneously, e.g. made from a common…
G06F 3/04166
Control or interface arrangements specially adapted for digitisers: details of scanning methods, e.g. sampling time, grouping of sub areas or time…
G06F 3/0445
By capacitive means: using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
G06F 3/0446
By capacitive means: using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Method for fabricating thin touch sensor panels

Life of this patent

Method for fabricating thin touch sensor panels

Life of this patent

Abstract

Claims11